SHAH, Shlok. Blueprints for SoC Integration: Reusable IP, Packetized Fabrics, and Test-Ready Platforms. International Journal of Intelligent Systems and Data Science, [S. l.], v. 1, n. 3, 2026. DOI: 10.67231/7dhz5r03. Disponível em: https://journals.femington.com/ijisds/article/view/300. Acesso em: 17 aug. 2026.